H10F 39/809
Of hybrid image sensors
Official title: {of hybrid image sensors}
H10F39/809 (Of hybrid image sensors) appears on 3,047 US grants and 4,024 published applications in this corpus.
Search patents in H10F- Granted patents
- 3,047
- Published applications
- 4,024
- Assignees
- 517
- Inventors
- 4,168
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 8 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 0 |
| 2002 | 10 | 13 |
| 2003 | 9 | 16 |
| 2004 | 15 | 29 |
| 2005 | 23 | 32 |
| 2006 | 19 | 57 |
| 2007 | 31 | 46 |
| 2008 | 27 | 60 |
| 2009 | 33 | 65 |
| 2010 | 59 | 96 |
| 2011 | 63 | 47 |
| 2012 | 51 | 63 |
| 2013 | 49 | 107 |
| 2014 | 83 | 125 |
| 2015 | 120 | 172 |
| 2016 | 180 | 224 |
| 2017 | 196 | 246 |
| 2018 | 240 | 274 |
| 2019 | 241 | 290 |
| 2020 | 271 | 295 |
| 2021 | 217 | 293 |
| 2022 | 213 | 318 |
| 2023 | 218 | 310 |
| 2024 | 252 | 355 |
| 2025 | 252 | 305 |
| 2026 | 152 | 186 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Signal shielding for integrated circuits29 Sep 2026US 12,751,104 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Image sensor architectures that employ multi-potential dynamic substrate biasing22 Sep 2026US 12,745,468 B2Apple Inc.
- Solid-state imaging element and imaging system22 Sep 2026US 12,745,469 B2Sony Semiconductor Solutions Corporation
- Pixel with dual-PD layout22 Sep 2026US 12,745,477 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Radiation detector for position-resolved detection of radiation22 Sep 2026US 12,745,478 B2Dectris AG
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photoelectric conversion apparatus8 Oct 2026US 2026/0313262 A1Canon Kabushiki Kaisha
- Image sensor with shared gate architecture for metal layer reduction8 Oct 2026US 2026/0314092 A1OmniVision Technologies, Inc.
- Image sensor8 Oct 2026US 2026/0314093 A1Postech Research and Business Development Foundation
- Extended via connect for pixel array8 Oct 2026US 2026/0314392 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Apparatus for multiple camera devices and method of operating same466US 7,199,348 B2Newport Imaging Corporation · 2007
- Vertically stacked image sensor284US 8,773,562 B1Apple Inc. · 2014
- Digital camera with integrated infrared (IR) response277US 7,566,855 B22009
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016