Solid-state imaging element and imaging system
AssigneeSony Semiconductor Solutions Corporation
InventorsMakoto Nakamura, Shin Kitano, Yusuke Murakawa, Koya Tsuchimoto, Takuya Hanada, Yuki Noda
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AssigneeSony Semiconductor Solutions Corporation
InventorsMakoto Nakamura, Shin Kitano, Yusuke Murakawa, Koya Tsuchimoto, Takuya Hanada, Yuki Noda
Estimating the term…
A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoelectrically converts incident light to generate a photocurrent. The second substrate (detection chip) is provided with a luminance change detection circuit (current-voltage conversion circuit) that detects a change in luminance of the incident light on the basis of a voltage signal converted by a conversion circuit (current-voltage conversion circuit) that converts the photocurrent into the voltage signal, and is bonded to the first substrate (light reception chip). A light shielding unit (light shielding film) provided in at least any one of the first substrate (light reception chip) or the second substrate (detection chip) and shields light between an active element (transistor TR) provided in the second substrate (detection chip) and the photodiode is included.
A solid-state imaging element, comprising:
An imaging system, comprising:
Dependencies are inferred from the claim text.