H10D 89/105
Adapted for thermal considerations
Official title: {adapted for thermal considerations}
H10D89/105 (Adapted for thermal considerations) appears on 196 US grants and 155 published applications in this corpus.
Search patents in H10D- Granted patents
- 196
- Published applications
- 155
- Assignees
- 116
- Inventors
- 402
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 1 | 4 |
| 2003 | 3 | 0 |
| 2004 | 3 | 3 |
| 2005 | 2 | 6 |
| 2006 | 3 | 3 |
| 2007 | 1 | 0 |
| 2008 | 2 | 6 |
| 2009 | 2 | 5 |
| 2010 | 4 | 5 |
| 2011 | 5 | 3 |
| 2012 | 5 | 5 |
| 2013 | 5 | 10 |
| 2014 | 7 | 5 |
| 2015 | 6 | 8 |
| 2016 | 6 | 9 |
| 2017 | 9 | 12 |
| 2018 | 8 | 11 |
| 2019 | 15 | 14 |
| 2020 | 12 | 16 |
| 2021 | 16 | 6 |
| 2022 | 5 | 5 |
| 2023 | 2 | 8 |
| 2024 | 3 | 3 |
| 2025 | 4 | 1 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems, devices, and methods for dedicated low temperature design and operation21 Apr 2026US 12,608,528 B2Arm Limited
- Semiconductor memory devices31 Mar 2026US 12,593,448 B2Samsung Electronics Co., Ltd.
- Semiconductor device having a temperature sensor, a transistor, and a diode3 Mar 2026US 12,568,637 B2Fuji Electric Co., Ltd.
- Thin film resistor10 Feb 2026US 12,548,699 B2Viking Tech Corporation
- Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment2 Dec 2025US 12,489,026 B2Intel Corporation
- Semiconductor device17 Sep 2026US 2026/0282558 A1Kabushiki Kaisha Toshiba
- Semiconductor device and manufacturing method thereof23 Jul 2026US 2026/0214996 A1Dynax Semiconductor, Inc.
- Semiconductor device18 Jun 2026US 2026/0173533 A1Denso Corporation
- Multi-finger semiconductor devices with dummy gate structures7 May 2026US 2026/0129971 A1GLOBALFOUNDRIES U. S. Inc.
- Power microelectronic device8 Jan 2026US 2026/0011617 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Temperature management for integrated circuits239US 5,502,838 AConsilium Overseas Limited · 1996
- Three-dimensional integrated circuit design device, three-dimensional integrated circuit design, method, and program202US 8,566,762 B2Panasonic Corporation · 2013
- Monolithic silicon integrated circuit chip for a thermal ink jet printer122US 4,947,192 AXerox Corporation · 1990
- Semiconductor integrated circuit device87US 7,508,238 B2Elpida Memory, Inc. · 2009
- Semiconductor integrated circuit with a response time compensated with respect to temperature86US 4,473,762 ATokyo Shibaura Denki Kabushiki Kaisha · 1984