Temperature management for integrated circuits
AssigneeConsilium Overseas Limited
InventorDan Kikinis
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AssigneeConsilium Overseas Limited
InventorDan Kikinis
Estimating the term…
A system for controlling temperature buildup in an IC employs a temperature sensor to provide an indication of the IC temperature to a control circuit which is configured to provide an operational clock rate to the IC which is less than the system clock rate, based on a function of the temperature of the IC or its package. In one embodiment temperature sensors are implemented as solid-state circuitry within different functional areas of a single IC, such as a microprocessor, In other embodiments, operating voltage is lowered as operating frequency is lowered. In yet another embodiment temperature sensing of multiple processors in a system is provided to a controller or controllers which are configured to allocate workload between the processors as a means to limit temperature rise, as well as to lower operational clock rate and to lower operating voltage.
In a single integrated circuit (IC) chip having first and second functional circuits occupying distinct first and second regions of the chip, a system for selective regional temperature control, comprising:
A system for controlling temperature of individual microprocessors in a multiprocessor system, wherein the microprocessors are interconnected by a bus, comprising:
A method for selective regional temperature control in a microprocessor chip having first and second distinct functional circuits occupying distinct first and second regions of the chip respectively, comprising steps of:
A method for controlling temperature of individual microprocessors in a multiprocessor system, wherein the microprocessors are interconnected by a bus, comprising steps of:
Dependencies are inferred from the claim text.