H10D 84/927
For capacitive loading
Official title: {for capacitive loading}
H10D84/927 (For capacitive loading) appears on 2 US grants and 5 published applications in this corpus.
Search patents in H10D- Granted patents
- 2
- Published applications
- 5
- Assignees
- 4
- Inventors
- 13
- Latest grant
- 21 Apr 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and method of fabricating the same23 Jul 2026US 2026/0214983 A1Samsung Electronics Co., Ltd.
- Hybrid channel semiconductor device and method of fabricating the same9 Jul 2026US 2026/0198088 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, operation method of semiconductor device, and manufacturing method of semiconductor device11 Jul 2019US 2019/0214408 A1Sony Semiconductor Solutions Corporation
- Cell structure in intergrated circuits for eco at upper metal layer and method for forming spare cell structure9 Mar 2017US 2017/0069660 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents