H10D 62/57
The imperfections being on the surface of the semiconductor body
Official title: the imperfections being on the surface of the semiconductor body, e.g. the body having a roughened surface
H10D62/57 (The imperfections being on the surface of the semiconductor body) appears on 278 US grants and 342 published applications in this corpus.
Search patents in H10D- Granted patents
- 278
- Published applications
- 342
- Assignees
- 139
- Inventors
- 696
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 1 | 3 |
| 2004 | 2 | 4 |
| 2005 | 3 | 1 |
| 2006 | 2 | 1 |
| 2007 | 1 | 3 |
| 2008 | 2 | 6 |
| 2009 | 3 | 6 |
| 2010 | 3 | 9 |
| 2011 | 6 | 8 |
| 2012 | 7 | 5 |
| 2013 | 4 | 12 |
| 2014 | 8 | 29 |
| 2015 | 26 | 34 |
| 2016 | 30 | 28 |
| 2017 | 29 | 32 |
| 2018 | 18 | 26 |
| 2019 | 24 | 17 |
| 2020 | 24 | 21 |
| 2021 | 12 | 23 |
| 2022 | 17 | 15 |
| 2023 | 10 | 14 |
| 2024 | 16 | 19 |
| 2025 | 9 | 18 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Organic light emitting diode display apparatus10 Feb 2026US 12,550,432 B2LG Display Co., Ltd.
- Semiconductor structure and fabrication method thereof16 Jul 2026US 2026/0206310 A1Nanya Technology Corporation
- Fabrication process for hemt devices with field plates25 Jun 2026US 2026/0181934 A1NXP USA, Inc.
- Organic Light Emitting Diode Display Apparatus14 May 2026US 2026/0136667 A1LG Display Co., Ltd.
- Integrated circuit packages including 3 dimensional die stacks with a die having a sidewall modification26 Mar 2026US 2026/0090454 A1Intel Corporation
- Semiconductor device and manufacturing method thereof26 Feb 2026US 2026/0060023 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Integrated circuit on corrugated substrate310US 7,190,050 B2Synopsys, Inc. · 2007
- Integrated circuit on corrugated substrate274US 7,528,465 B2Synopsys, Inc. · 2009
- Methods of designing an integrated circuit on corrugated substrate139US 7,960,232 B2Synopsys, Inc. · 2011
- Method for extreme ultraviolet electrostatic chuck with reduced clamp effect94US 8,765,582 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate72US 7,442,629 B2President and Fellows of Harvard College · 2008