H10D 48/07
Of devices having bodies comprising cuprous oxide [cu2o] or cuprous iodide [cui]
Official title: of devices having bodies comprising cuprous oxide [Cu2O] or cuprous iodide [CuI]
H10D48/07 (Of devices having bodies comprising cuprous oxide [cu2o] or cuprous iodide [cui]) appears on 20 US grants and 24 published applications in this corpus.
Search patents in H10D- Granted patents
- 20
- Published applications
- 24
- Assignees
- 19
- Inventors
- 57
- Latest grant
- 26 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 4 | 0 |
| 2015 | 3 | 5 |
| 2016 | 4 | 5 |
| 2017 | 3 | 0 |
| 2018 | 0 | 3 |
| 2019 | 1 | 0 |
| 2020 | 2 | 3 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year.
Subgroups
Granted patents
Recent patents
- Field-effect transistor with a total control of the electrical conductivity on its channel26 Apr 2022US 11,316,017 B2Luxembourg Institute of Science and Technology (List)
- Non-contact measurement of a stress in a film on a substrate30 Mar 2021US 10,964,730 B2Applejack 199 L,P.,
- Non-contact measurement of a stress in a film on a substrate4 Feb 2020US 10,553,623 B2Applejack 199 L,P.,
- Annealing method for improving bonding strength7 Jan 2020US 10,529,590 B2Shanghai Simgui Technology Co., Ltd.
- Method and device for processing photoresist component5 Nov 2019US 10,466,545 B2Beijing Boe Display Technology Co., Ltd.
- Bonded object production method and production method for ceramic circuit substrate using same7 Mar 2024US 2024/0079238 A1Kabushiki Kaisha Toshiba
- Field-effect transistor with a total control of the electrical conductivity on its channel20 Aug 2020US 2020/0266277 A1Luxembourg Institute of Science and Technology (List)
- Method for planarizing wafer surface28 May 2020US 2020/0168452 A1Shanghai Simgui Technology Co., Ltd.
- Non-contact measurement of a stress in a film on a substrate14 May 2020US 2020/0152783 A1Applejack 199 L,P.,
- Annealing method for improving bonding strength15 Nov 2018US 2018/0330964 A1Shanghai Simgui Tehcnology Co., Ltd.
Most cited
By later US patents
- Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device39US 8,765,522 B2Semiconductor Energy Laboratory Co.Ltd. · 2014
- Stable amorphous metal oxide semiconductor19US 9,306,078 B2Cbrite Inc. · 2016
- Stable amorphous metal oxide semiconductor18US 8,907,336 B2Cbrite Inc. · 2014
- Stable amorphous metal oxide semiconductor14US 9,099,563 B2Cbrite Inc. · 2015
- Method for the formation of a cuprous oxide film and process for the production of a semiconductor device using said method9US 6,258,702 B1Canon Kabushiki Kaisha · 2001