Method and device for processing photoresist component
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Display Technology Co., Ltd.
InventorsShichao Ma, Pengfei Wang, Chongxi Wei
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Abstract
The present disclosure provides a method for processing a photoresist component, including steps of: placing a photoresist component to be processed on a heating device comprising a plurality of heating components; and controlling, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed. The heating parameter is determined based on a photoresist component parameter of the photoresist component to be processed and a process parameter of forming the photoresist component. The present disclosure further provides a device for processing a photoresist component.
Claims10
A method for processing a photoresist component, comprising steps of:
- placing a photoresist component to be processed on a heating device comprising a plurality of heating components;
- and
- controlling, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed,
- wherein the heating parameter is determined based on a photoresist component parameter of the photoresist component to be processed and a process parameter of forming the photoresist component,
- wherein the heating parameter comprises a heating temperature, and the photoresist component parameter comprises a size of the photoresist component and a position of the photoresist component on a substrate,
- wherein the process parameter comprises a development process parameter comprising a tilt direction and a tilt degree of a developing machine,
- wherein the method further comprises:
- determining an upstream position and a downstream position in a flow direction of a developing liquid based on the tilt direction and the tilt degree, and determining amounts of the developing liquid at the upstream position and the downstream position of the substrate, respectively;
- estimating the sizes of the photoresist components at different positions on the substrate according, to an inverse proportional relationship between the amount of the developing liquid and the size of the photoresist component;
- and
- determining the heating temperature according to an inverse proportional relationship between the estimated size if the photoresist component and the heating temperature.
A device for processing a photoresist component, comprising:
- a heating device comprising a plurality of heating components and configured to carry a photoresist component to be processed thereon;
- and
- a controller configured to control, based on a heating parameter, each of the plurality of heating components associated with the heating parameter to heat the photoresist component to be processed,
- wherein the heating parameter is determined based on a photoresist component parameter of the photoresist component to be processed and a process parameter of forming the photoresist component,
- wherein the heating parameter comprises a heating temperature, and the photoresist component parameter comprises a size of the photoresist component and a position of the photoresist component on a substrate,
- wherein the process parameter comprises a development process parameter comprising a tilt direction and a tilt degree of a developing machine,
- wherein an upstream position and a downstream position in a flow direction of a developing liquid is determined based on the tilt direction and the tilt degree, and amounts of the developing liquid at the upstream position and the downstream position of the substrate are determined, respectively,
- wherein the sites of the photoresist components at different positions on the substrate are estimated according to an inverse proportional relationship between the amount of the developing liquid and the size of the photoresist component,
- wherein the heating temperature is determined according to an inverse proportional relationship between the estimated size of the photoresist component and the heating temperature.
Dependencies are inferred from the claim text.