H05K 7/20809
Within server blades for removing heat from heat source
Official title: {within server blades for removing heat from heat source}
H05K7/20809 (Within server blades for removing heat from heat source) appears on 481 US grants and 800 published applications in this corpus.
Search patents in H05K- Granted patents
- 481
- Published applications
- 800
- Assignees
- 203
- Inventors
- 1,132
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 2 |
| 2003 | 3 | 10 |
| 2004 | 7 | 6 |
| 2005 | 3 | 10 |
| 2006 | 7 | 4 |
| 2007 | 3 | 3 |
| 2008 | 2 | 5 |
| 2009 | 2 | 4 |
| 2010 | 7 | 15 |
| 2011 | 12 | 11 |
| 2012 | 4 | 14 |
| 2013 | 14 | 23 |
| 2014 | 12 | 35 |
| 2015 | 24 | 34 |
| 2016 | 31 | 26 |
| 2017 | 22 | 35 |
| 2018 | 30 | 29 |
| 2019 | 27 | 23 |
| 2020 | 31 | 36 |
| 2021 | 30 | 31 |
| 2022 | 25 | 70 |
| 2023 | 40 | 66 |
| 2024 | 59 | 53 |
| 2025 | 51 | 77 |
| 2026 | 28 | 178 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- 3-way quick-disconnect fluid couplings with automatic bypass switching29 Sep 2026US 12,748,469 B2Hewlett Packard Enterprise Development LP
- Server with hybrid thermal management system15 Sep 2026US 12,740,020 B2Carrier Corporation
- System for the reuse of heat in a data center15 Sep 2026US 12,740,025 B2Advanced Liquid Cooling Technologies Inc.
- Two phase shower immersion cooling system for data center: soaking pockets18 Aug 2026US 12,713,565 B2Jemm's Labs
- Cold plate with folded heat dissipation features for datacenter cooling systems11 Aug 2026US 12,707,595 B2NVIDIA Corporation
- A heat exchanger for an electronic component of a server1 Oct 2026US 2026/0304698 A1Y.E. Hub Armenia LLC
- Cryogenic data center rack1 Oct 2026US 2026/0304700 A1Psiquantum, Corp.
- Equalizing flow manifold with bernoulli-derived hierarchical geometry, asymmetric inlet/outlet architectures, and modular polygonal flow units, and cooling apparatus including same24 Sep 2026US 2026/0287276 A1HRL Laboratories, LLC
- Vapor quality control in cooling distribution unit24 Sep 2026US 2026/0293063 A1
- Compositions of immersion fluids with contaminants17 Sep 2026US 2026/0282293 A1The Chemours Company Fc, LLC
Most cited
By later US patents
- Large area, multi-device heat pipe for stacked MCM-based systems163US 6,055,157 ACray Research, Inc. · 2000
- Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling143US 8,014,150 B2International Business Machines Corporation · 2011
- Cooling structure for disk storage device113US 6,927,980 B2Hitachi, Ltd. · 2005
- Single or dual buss thermal transfer system92US 6,796,372 B2Liebert Corporation · 2004
- IT equipment cooling90US 7,165,412 B1American Power Conversion Corporation · 2007