Single or dual buss thermal transfer system
AssigneeLiebert Corporation
InventorDaniel B. Bear
Life of this patent
Estimating the term…
Abstract
A cooling system for use in conjunction with electronic devices (such as a computer) is disclosed. The cooling system is composed of several segments that comprise a continuous thermal path from the heat producing electronic component to a primary fluid circuit. The system transfers the heat to a secondary fluid circuit. The primary circuit is sealed and allows the transfer of heat to the secondary circuit without the requirements of the secondary fluid being directly connected through hoses or other means to the electronic device.
Claims26
A cooling system for an electronic device containing a heat generating component, the cooling system comprising:
- a heat pipe circuit comprising:
- an evaporator disposed adjacent to and in thermal communication with the heat generating component;
- at least one condenser disposed adjacent to and in thermal communication with at least one intermediate heat exchanger located at an exterior surface of the electronic device;
- and
- a fluid connection between the evaporator and the at least one condenser;
- a thermal fluid contained within the heat pipe circuit;
- and
- a final heat absorber disposed adjacent to and in thermal communication with the at least one intermediate heat exchanger, wherein said final heat absorber is adapted for fluid circulation to remove heat from the at least one intermediate heat exchanger to a location remote from said electronic device, and wherein the at least one intermediate heat exchanger and the final heat absorber further comprise complementary interlocking heat exchange surfaces.
A cooling system for an electronic device containing a plurality of heat generating components, the cooling system comprising:
- a heat pipe circuit comprising:
- a plurality of evaporators, each evaporator being disposed adjacent to and in thermal communication with one of the heat generating components;
- at least one condenser disposed adjacent to and in thermal communication with at least one intermediate heat exchanger located at an exterior surface of the electronic device;
- and
- a fluid connection between the plurality of evaporators and the at least one condenser;
- a thermal fluid contained within the heat pipe circuit;
- and
- a final heat absorber disposed adjacent to and in thermal communication with the at least one intermediate heat exchanger, wherein said final heat absorber is adapted for fluid circulation to remove heat from the at least one intermediate heat exchanger to a location remote from said electronic device, and wherein the at least one intermediate heat exchanger and the final heat absorber further comprise complementary interlocking heat exchange surfaces.
A cooling system for an electronic device containing a plurality of heat generating components, the cooling system comprising:
- a heat pipe circuit comprising:
- a plurality of evaporators, each evaporator being disposed adjacent to and in thermal communication with one of the heat generating components;
- a plurality of condensers disposed adjacent to and in thermal communication with at least one intermediate heat exchanger located at an exterior surface of the electronic device;
- and
- a fluid connection between the plurality of evaporators and the plurality of condensers;
- a thermal fluid contained within the heat pipe circuit;
- and
- a final heat absorber disposed adjacent to and in thermal communication with the at least one intermediate heat exchanger, wherein said final heat absorber is adapted for fluid circulation to remove heat from said at least one intermediate heat exchanger to a location remote from said electronic device, and wherein the at least one intermediate heat exchanger and the final heat absorber further comprise complementary interlocking heat exchange surfaces.
Dependencies are inferred from the claim text.