Cold plate with folded heat dissipation features for datacenter cooling systems
AssigneeNVIDIA Corporation
InventorAli Heydari
Life of this patent
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Abstract
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes folded heat dissipation features to be cooled by at least one two-phase fluid via folded heat dissipation features having first and second channels of different widths; having first mechanical couplings for top portions of such folded heat dissipation features to an upper section of a cold pate; and having second mechanical couplings for bottom portions of the folded heat dissipation features to a lower section of the cold plate.
Claims20
A datacenter cooling system, comprising:
- a cold plate comprising a plurality of folded heat dissipation features to be cooled by at least one two-phase fluid, the folded heat dissipation features forming first channels having a first width and second channels having a different second width, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels, the folded heat dissipation features comprising first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.
A processor comprising one or more circuits, the processor to receive cooling requirements for a datacenter cooling system, the one or circuits to cause cooling by a two-phase fluid through a cold plate that comprises a plurality of folded heat dissipation features, the folded heat dissipation features forming first channels having a first width and second channels having a different second width, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels, the folded heat dissipation features comprising first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.
A method for datacenter cooling system, comprising:
- providing a cold plate comprising a plurality of folded heat dissipation features to be cooled by at least one two-phase fluid;
- enabling the folded heat dissipation features to channel the at least one two-phase fluid through first channels having a first width and second channels having a different second width, formed by the plurality of folded heat dissipation features, wherein the first width is constant along a first length of the first channels, and wherein the second width is constant along a second length of the second channels;
- and
- retaining the at least one two-phase fluid in the cold plate by first mechanical couplings along at least one of the first length or the second length to couple top folds of the folded heat dissipation features to an upper section of the cold plate and second mechanical couplings along at least one of the first length or the second length to couple bottom folds of the folded heat dissipation features to a lower section of the cold plate.
Dependencies are inferred from the claim text.