Server with hybrid thermal management system
AssigneesCarrier Corporation, Equinix, Inc.
InventorsArindom Joardar, Richard Lord, Michel Grabon, Tobias Sienel, My Dinh Truong, Tikhon Suresh Pichai
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Abstract
A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device includes cooling the at least one heat-generating electronic device with a primary cooling fluid and cooling the at least one heat-generating electronic device and the at least one peripheral heat-generating device with a secondary cooling fluid. The secondary cooling fluid is distinct from the primary cooling fluid.
Claims20
A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device, the method comprising:
- cooling a secondary cooling fluid with a primary cooling fluid at a heat exchanger, the heat exchanger being arranged upstream from the at least one heat-generating electronic device and at least one peripheral heat-generating device relative to a primary cooling fluid and a secondary cooling fluid;
- cooling the at least one heat-generating electronic device with the primary cooling fluid via a heat removal device thermally coupled to the at least one heat-generating electronic device;
- cooling the secondary cooling fluid with the primary cooling fluid at the heat removal device;
- and
- cooling the at least one peripheral heat-generating device with the secondary cooling fluid at a location downstream from the heat removal device.
A cooling system for cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device, the cooling system comprising:
- a heat exchanger arranged upstream from the at least one heat-generating electronic device and at least one peripheral heat-generating device;
- another heat exchanger mounted in overlapping arrangement with the at least one heat-generating electronic device, the another heat exchanger being thermally coupled to the at least one heat-generating electronic device;
- wherein a primary cooling fluid and a secondary cooling fluid are arranged in a heat exchange relationship at both the heat exchanger and the another heat exchanger, the secondary cooling fluid being cooled by the primary cooling fluid at both the heat exchanger and the another heat exchanger, wherein the another heat exchanger is arranged downstream from the heat exchanger relative to the primary cooling fluid and the at least one peripheral heat-generating device is arranged downstream from an outlet of the another heat exchanger relative to a flow of the second cooling fluid.
Dependencies are inferred from the claim text.