Cooling structure for disk storage device
AssigneeHitachi, Ltd.
InventorsHiroshi Fukuda, Kenji Fujita
Life of this patent
Estimating the term…
Abstract
A disk drive box 10 accommodates a plurality of disk drives 20 within a case 11. A side face of each of the drives 20 is provided with a heat-absorbing part 40 including a heat pipe, corresponding to heat producing area HP. The heat taken away by the heat-absorbing part 40 is transmitted to a heat sink 50 of the rear of a backboard 30 via a heat connector 60. The heat sink 50 is cooled by cooling air flowing through an air duct 7. By cooling the drive 20 with the heat pipe, clearances between the drives 20 can be substantially eliminated, and it is made unnecessary to form an opening for air cooling in the backboard 30. Thus, size reduction is possible, and it is possible to increase the degree of freedom for a wiring pattern formed on the backboard 30.
Claims13
A cooling structure for a disk storage device accommodating at least one disk drive, comprising:
- the disk storage device having a connection board to which the disk drive is electrically connected such that data input/output to/from the disk drive is performed via a signal line formed on the connection board;
- a heat-absorbing part provided on the disk drive;
- a heat-dissipating part exposed outside the disk storage device;
- and
- a heat-transferring part for connecting the heat-absorbing part and the heat-dissipating part,
- wherein heat generated by the disk drive is transmitted from the heat-absorbing part via the heat-transferring part to the heat-dissipating part to radiate the heat, whereby an opening for air cooling is substantially eliminated from the connection board, and
- wherein the heat-transferring part separably includes a heat-absorbing-side heat-transferring part coupled to the heat-absorbing part and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact.
A disk array apparatus comprising:
- a plurality of disk storage devices for connecting a plurality of disk drives to a connection board having a signal line for electrically connecting the disk drives with each other, and for accommodating the disk drives substantially in close contact with each other;
- a device housing for accommodating the disk storage devices;
- a cooling mechanism provided in the device housing;
- heat-absorbing parts respectively provided for the disk drives;
- at least one heat-dissipating part exposed outside of the disk storage devices;
- and
- heat-transferring parts each for connecting one of the heat-absorbing parts and the heat-dissipating part with each other,
- wherein heat generated by the disk drives is transmitted from the heat-absorbing parts via the heat-transferring part to the heat-dissipating parts and is radiated from the heat-dissipating part via the cooling mechanism, whereby substantially no opening for air cooling is formed in the connection board, and
- wherein each of the heat-transferring part, separably includes a heat-absorbing-side heat-transferring part coupled to said one the heat-absorbing parts and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact.
A cooling structure for a unit-accommodating enclosure accommodating at least one unit having a heat producing area inside, comprising:
- the unit connected to a connection board on which an information transmission path is formed such that information input/output to/from the unit is performed via the information transmission path;
- a heat-absorbing part provided on the unit;
- a heat-dissipating part exposed outside the unit-accommodating enclosure;
- and
- a heat-transferring part for connecting the heat-absorbing part and the heat-dissipating part;
- wherein heat generated by the unit is transmitted from the heat-absorbing part via the heat-transferring part to the heat-dissipating part and is radiated therefrom, whereby an opening for air cooling is substantially eliminated from the connection board, and
- wherein the heat-transferring part separably includes a heat-absorbing-side heat-transferring part coupled to the heat-absorbing part and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact.
Dependencies are inferred from the claim text.