H05K 3/108
By semi-additive methods
Official title: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)}
H05K3/108 (By semi-additive methods) appears on 1,099 US grants and 1,139 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,099
- Published applications
- 1,139
- Assignees
- 415
- Inventors
- 2,432
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 12 | 0 |
| 1985 | 8 | 0 |
| 1986 | 12 | 0 |
| 1987 | 15 | 0 |
| 1988 | 16 | 0 |
| 1989 | 16 | 0 |
| 1990 | 19 | 0 |
| 1991 | 22 | 0 |
| 1992 | 13 | 0 |
| 1993 | 17 | 0 |
| 1994 | 18 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 7 | 0 |
| 1998 | 18 | 0 |
| 1999 | 15 | 0 |
| 2000 | 18 | 0 |
| 2001 | 17 | 8 |
| 2002 | 22 | 27 |
| 2003 | 28 | 32 |
| 2004 | 28 | 46 |
| 2005 | 22 | 54 |
| 2006 | 22 | 55 |
| 2007 | 25 | 60 |
| 2008 | 36 | 72 |
| 2009 | 34 | 98 |
| 2010 | 37 | 56 |
| 2011 | 52 | 43 |
| 2012 | 56 | 53 |
| 2013 | 41 | 29 |
| 2014 | 19 | 46 |
| 2015 | 35 | 33 |
| 2016 | 27 | 26 |
| 2017 | 16 | 33 |
| 2018 | 25 | 29 |
| 2019 | 28 | 27 |
| 2020 | 35 | 50 |
| 2021 | 29 | 37 |
| 2022 | 37 | 57 |
| 2023 | 31 | 53 |
| 2024 | 48 | 57 |
| 2025 | 32 | 36 |
| 2026 | 25 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board8 Sep 2026US 12,733,101 B2Sumitomo Electric Printed Circuits, Inc.
- Wiring board and manufacturing method for the same18 Aug 2026US 12,713,526 B2KYOCERA Corporation
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Method for manufacturing wiring board, and wiring board9 Jun 2026US 12,652,762 B2
- Circuit board and manufacturing method of circuit board1 Oct 2026US 2026/0304639 A1Samsung Electro-Mechanics Co., Ltd.
- Higher current surface mount pads and circuit assembly24 Sep 2026US 2026/0292979 A1
- Wiring board and method for manufacturing wiring board13 Aug 2026US 2026/0239527 A1Dai Nippon Printing Co.Ltd.
- Hyper density package substrate and memory coupled to a modified semi-additive process board30 Jul 2026US 2026/0223751 A1Intel Corporation
- Circuit board and manufacturing method thereof23 Jul 2026US 2026/0214800 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Flexible bio-probe assembly185US 6,973,342 B1Advanced Neuromodulation Systems, Inc. · 2005
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991