Hyper density package substrate and memory coupled to a modified semi-additive process board

A package, comprising:

• a pitch translator having a first side above a second side, the second side having a first plurality of bumps having a first pitch;
• a first die attached to the first side of the pitch translator by a second plurality of bumps, the second plurality of bumps having a second pitch, the second pitch tighter pitch than the first pitch;
• a second die attached to the first die, the first die vertically between the second die and the pitch translator;
• a third die attached to the first die, the third die laterally spaced apart from the second die;
• a fourth die attached to the fifth die, the fourth die laterally spaced apart from the third die;
• a first memory module laterally spaced apart from a first side of the first die and laterally spaced apart from the second die, the first memory module extending above a top of the second die, the third die and the fourth die;
• and
• a second memory module laterally spaced apart from a second side of the first die, the second side laterally opposite the first side, and the second memory module laterally spaced apart from the fourth die, the second memory module extending above the top of the second die, the third die and the fourth die.

A method of fabricating a package, the method comprising:

• providing a substrate having a first side above a second side, the second side having a first plurality of bumps having a first pitch;
• attaching a base die to the first side of the substrate by a second plurality of bumps, the second plurality of bumps having a second pitch, the second pitch tighter pitch than the first pitch;
• attaching a first die to the base die, the base die vertically between the first die and the substrate;
• attaching a second die to the base die, the second die laterally spaced apart from the first die;
• attaching a third die to the base die, the third die laterally spaced apart from the second die;
• providing a first memory module laterally spaced apart from a first side of the base die and laterally spaced apart from the first die, the first memory module extending above a top of the first die, the second die and the third die;
• and
• providing a second memory module laterally spaced apart from a second side of the base die, the second side laterally opposite the first side, and the second memory module laterally spaced apart from the third die, the second memory module extending above the top of the first die, the second die and the third die.