H05K 3/0088
For treatment of holes
Official title: {for treatment of holes}
H05K3/0088 (For treatment of holes) appears on 71 US grants and 29 published applications in this corpus.
Search patents in H05K- Granted patents
- 71
- Published applications
- 29
- Assignees
- 55
- Inventors
- 147
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 3 |
| 2004 | 2 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 1 |
| 2015 | 1 | 4 |
| 2016 | 2 | 2 |
| 2017 | 0 | 1 |
| 2018 | 3 | 3 |
| 2019 | 0 | 1 |
| 2020 | 3 | 2 |
| 2021 | 2 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 3 |
| 2025 | 2 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit-forming method and circuit-forming apparatus28 Jul 2026US 12,696,397 B2Fuji Corporation
- Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radar9 Dec 2025US 12,495,505 B2Shennan Circuits Co., Ltd.
- Etching device and etching method using the same4 Feb 2025US 12,217,978 B2Samsung Display Co., Ltd.
- Filling assembly9 Nov 2021US 11,172,578 B2ITC Intercircuit Electronic GmbH
- Desmearing method and desmearing device24 Aug 2021US 11,102,889 B2Ushio Denki Kabushiki Kaisha
- Circuit-forming method and circuit-forming apparatus19 Dec 2024US 2024/0422916 A1Fuji Corporation
- Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radar30 May 2024US 2024/0179852 A1Shennan Circuits Co., Ltd.
- Method for Manufacturing a Sheet with Double-Sided Structured Conducting Layers for Electronic Applications25 Jan 2024US 2024/0032207 A1
- Etching device and etching method using the same14 Jul 2022US 2022/0223436 A1Samsung Display Co., Ltd.
- Filling Assembly4 Feb 2021US 2021/0037655 A1ITC Intercircuit Electronic GmbH
Most cited
By later US patents
- Fluid delivery method30US 6,045,874 AAtotech USA, Inc. · 2000
- Apparatus and method for electroless plating29US 4,622,917 AETD Technology, Inc. · 1986
- Method of introducing liquid into small-diameter hole29US 5,215,593 ACanon Kabushiki Kaisha · 1993
- Fluid delivery apparatus and method22US 5,614,264 AAtotech USA, Inc. · 1997
- Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method20US 5,118,458 AMatsushita Electric Industrial Co., Ltd. · 1992