Desmearing method and desmearing device

A desmearing device for a wiring substrate material that is a laminated body of an insulating layer made from resin containing a filler and a conductive layer, said wiring substrate material having a through hole that penetrates through said insulation layer, said desmearing device comprising:

• an ultraviolet irradiation treatment unit configured to irradiate the wiring substrate material with an ultraviolet beam with a wavelength equal to or less than 220 nm in an atmosphere thereby removing a smear, which is derived from an organic substance, from the wiring substrate material;
• and
• a physical vibration treatment unit configured to apply physical vibrations to the wiring substrate material which is ultraviolet-treated by the ultraviolet irradiation treatment unit thereby removing a smear, which is derived from an inorganic substance, from the wiring substrate material.