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US 2022/0223436 A1Published application
Etching device and etching method using the same
AssigneeSamsung Display Co., Ltd.
InventorsWONJE CHO, DUCKJUNG LEE
Life of this patent
Estimating the term…
Abstract
An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.
Claims20
An etching device comprising:
- a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part,
- wherein the etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.
A method of etching, the method comprising:
- contacting a nozzle unit to a lower surface of an etching object, wherein the nozzle unit includes at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part, the etching solution injection hole provides an etching solution to an etching object, the etching solution collection hole collects the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage, and
- etching the etching object by spraying the etching solution to the lower surface of the etching object through the etching solution injection hole.
Dependencies are inferred from the claim text.