Circuit-forming method and circuit-forming apparatus
AssigneeFuji Corporation
InventorKenji TSUKADA
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Abstract
A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin, and a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.
Claims6
A circuit-forming method comprising:
- a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin;
- and
- a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device.
A circuit-forming apparatus comprising:
- a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin;
- and
- a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.
Dependencies are inferred from the claim text.