H05K 2203/30
Details of processes not otherwise provided for in h05k2203/01 - h05k2203/17
Official title: Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
H05K2203/30 (Details of processes not otherwise provided for in h05k2203/01 - h05k2203/17) appears on 747 US grants and 735 published applications in this corpus.
Search patents in H05K- Granted patents
- 747
- Published applications
- 735
- Assignees
- 414
- Inventors
- 1,934
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 4 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 14 | 0 |
| 1993 | 13 | 0 |
| 1994 | 9 | 0 |
| 1995 | 11 | 0 |
| 1996 | 6 | 0 |
| 1997 | 13 | 0 |
| 1998 | 6 | 0 |
| 1999 | 16 | 0 |
| 2000 | 20 | 0 |
| 2001 | 17 | 7 |
| 2002 | 16 | 19 |
| 2003 | 10 | 22 |
| 2004 | 19 | 27 |
| 2005 | 17 | 40 |
| 2006 | 18 | 42 |
| 2007 | 16 | 34 |
| 2008 | 23 | 48 |
| 2009 | 34 | 71 |
| 2010 | 34 | 49 |
| 2011 | 31 | 25 |
| 2012 | 33 | 25 |
| 2013 | 29 | 20 |
| 2014 | 19 | 32 |
| 2015 | 33 | 41 |
| 2016 | 31 | 34 |
| 2017 | 25 | 23 |
| 2018 | 22 | 25 |
| 2019 | 34 | 24 |
| 2020 | 21 | 25 |
| 2021 | 22 | 22 |
| 2022 | 16 | 20 |
| 2023 | 8 | 19 |
| 2024 | 17 | 22 |
| 2025 | 20 | 15 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Removable lid for flip chip-ball grid array (FC-BGA) packages7 Jul 2026US 12,677,380 B2Mellanox Technologies, Ltd.
- Temporary panel rails23 Jun 2026US 12,666,544 B2Rockwell Collins, Inc.
- Soldering system and method of use31 Mar 2026US 12,589,445 B2Illinois Tool Works Inc.
- Electronic device and manufacturing method thereof31 Mar 2026US 12,593,399 B2Carux Technology Pte. Ltd.
- Method and device for depositing components on a substrate9 Jul 2026US 2026/0198152 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material9 Apr 2026US 2026/0101448 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for fabricating a circuit board arrangement, circuit board pre-assembly and implantable medical device comprising a circuit board arrangement26 Mar 2026US 2026/0089901 A1Biotronik SE & Co.KG
- Circuit board and manufacturing method thereof26 Feb 2026US 2026/0059646 A1Avary Holding (Shenzhen) Co., Limited.
- Printed Circuit Board Including a First Portion and a Second Portion with a Pillar Extending from the First Portion6 Nov 2025US 2025/0344318 A1Google Inc.
Most cited
By later US patents
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards178US 6,464,121 B2Xerox Corporation · 2002
- Method of mounting interrelated components150US 4,371,912 AMotorola, Inc. · 1983