H05K 2203/304
Protecting a component during manufacturing
H05K2203/304 (Protecting a component during manufacturing) appears on 173 US grants and 126 published applications in this corpus.
Search patents in H05K- Granted patents
- 173
- Published applications
- 126
- Assignees
- 138
- Inventors
- 451
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 15 | 0 |
| 2001 | 5 | 2 |
| 2002 | 4 | 2 |
| 2003 | 2 | 4 |
| 2004 | 4 | 7 |
| 2005 | 4 | 11 |
| 2006 | 5 | 5 |
| 2007 | 3 | 9 |
| 2008 | 4 | 10 |
| 2009 | 10 | 15 |
| 2010 | 9 | 8 |
| 2011 | 6 | 4 |
| 2012 | 5 | 2 |
| 2013 | 2 | 5 |
| 2014 | 2 | 3 |
| 2015 | 4 | 9 |
| 2016 | 7 | 6 |
| 2017 | 8 | 2 |
| 2018 | 3 | 2 |
| 2019 | 2 | 3 |
| 2020 | 3 | 3 |
| 2021 | 3 | 3 |
| 2022 | 0 | 2 |
| 2023 | 1 | 3 |
| 2024 | 3 | 3 |
| 2025 | 4 | 2 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Removable lid for flip chip-ball grid array (FC-BGA) packages7 Jul 2026US 12,677,380 B2Mellanox Technologies, Ltd.
- Connecting board and manufacturing method of the same10 Mar 2026US 12,575,031 B2Samsung Electro-Mechanics Co., Ltd.
- Release film19 Aug 2025US 12,396,104 B2Samsung Display Co., Ltd.
- Manufacture of a curved electronic device using differential heating and curved electronic device1 Jul 2025US 12,349,272 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Release film15 Apr 2025US 12,275,228 B2Samsung Display Co., Ltd.
- Method for fabricating a circuit board arrangement, circuit board pre-assembly and implantable medical device comprising a circuit board arrangement26 Mar 2026US 2026/0089901 A1Biotronik SE & Co.KG
- Apparatus, system, and method of providing a tray for holding an optoelectronic device during printed circuit board manufacturing29 May 2025US 2025/0172759 A1Jabil Inc.
- Corner shield protection for surface mount devices6 Mar 2025US 2025/0081351 A1Snap Inc.
- Connecting board and manufacturing method of the same5 Sep 2024US 2024/0298407 A1Samsung Electro-Mechanics Co., Ltd.
- Removable lid for flip chip-ball grid array (fc-bga) packages22 Aug 2024US 2024/0284603 A1Mellanox Technologies, Ltd.
Most cited
By later US patents
- Method of mounting interrelated components150US 4,371,912 AMotorola, Inc. · 1983
- Process for soldering electronic components to a printed circuit board75US 6,145,733 AHerbert Streckfuss GmbH · 2000
- Method and apparatus for insulating moisture sensitive PBGA's72US 6,059,170 AInternational Business Machines Corporation · 2000
- Method of wave soldering thin laminate circuit boards68US 6,202,916 B1Delphi Technologies, Inc. · 2001
- Terminal piece sealing structure54US 5,090,919 AOMRON Corporation · 1992