Connecting board and manufacturing method of the same

A connecting board comprising:

• a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction;
• a via passing through the core layer;
• connection pads that are coupled to both ends of the via;
• and
• reinforcing members that are provided on at least one of both surfaces of the core layer in the thickness direction, so as to be coupled to the core layer.

A manufacturing method of a connecting board comprising:

• forming a via in a core member so as to pass through the core member in a thickness direction, and forming connection pads on both ends of the via;
• sequentially forming solder resist layers and metal thin films on both surfaces of the core member in the thickness direction;
• forming masks using the metal thin films;
• and
• forming a partition space by discontinuously cutting so as to pass between an inner region and an outer region based on a plane perpendicular to the thickness direction, so as to define the outer region as the connecting board and the inner region as a reinforcement dummy.