Release film
AssigneeSamsung Display Co., Ltd.
InventorsHun-Tae Kim, Gyumdong Bae, Dongho Yoon
Life of this patent
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Abstract
A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.
Claims21
A release film on a printed circuit board and a connector connected to the printed circuit board, the release film comprising:
- a first release film disposed on a first surface of the printed circuit board and a surface of the connector;
- a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board;
- and
- a first adhesive attached to a portion of a surface of the first release film which does not overlap the second release film, the first adhesive comprising:
- a base film disposed on the surface of the first release film facing the printed circuit board;
- and
- a double-sided adhesive disposed between the first release film and the base film,
- wherein the base film extends in a direction parallel to an extension direction of the first release film, and
- the base film covers a portion of a surface of the second release film which does not directly face the first release film.
A release film disposed on a printed circuit board and a connector connected to the printed circuit board, the release film comprising:
- a first release film disposed on a first surface of the printed circuit board and a surface of the connector, and defining a first opening and a second opening adjacent to the first opening;
- a second release film disposed below the printed circuit board;
- and
- a first adhesive attached to a portion of the first release film which does not overlap the second release film, the first adhesive comprising:
- a base film disposed on the surface of the first release film facing the printed circuit board;
- and
- a double-sided adhesive disposed between the first release film and the base film,
- wherein the first opening exposes a connection portion of the printed circuit board and a first connection portion of the connector connected to the connection portion,
- the base film extends in a direction parallel to an extension direction of the first release film, and
- the base film covers a portion of a surface of the second release film which does not directly face the first release film.
A release film disposed on a printed circuit board connected to a display module, the release film comprising:
- a first release film disposed on a first surface of the printed circuit board and a first surface of a connector connected to the printed circuit board, and the first release film defining a first opening and a second opening adjacent to the first opening;
- and
- a first adhesive attached to a portion of the first release film, the first adhesive including:
- a double-sided adhesive attached to the portion of the first release film;
- and
- a base film attached to one side of the double-sided adhesive which does not face the first release film,
- wherein the first opening exposes a connection portion of the printed circuit board and a first connection portion of the connector connected to the connection portion.
Dependencies are inferred from the claim text.