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US 12,275,228 B2Granted
Release film
AssigneeSamsung Display Co., Ltd.
InventorsHun-Tae Kim, Kyunghoon Kim, Gyumdong Bae
Life of this patent
Estimating the term…
Abstract
A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.
Claims20
A release film comprising:
- a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board, wherein the first release film comprises a fixing portion having a shape extending in one direction;
- and
- a second release film disposed under the printed circuit board, the second release film including an incision portion,
- wherein the fixing portion extends into the incision portion.
1 more element
A release film comprising:
- a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board, wherein the first release film comprises a fixing portion having a shape extending in one direction;
- and
- a second release film disposed under the printed circuit board, the second release film including an incision portion,
- wherein the fixing portion extends into the incision portion and a portion of the fixing portion that is adjacent to a first side of the fixing portion is disposed under the second release film.
1 more element
A release film comprising:
- a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board, wherein the first release film includes a fixing portion having a first incision portion extending through the first release film in a first direction and defining a first side of the fixing portion and second incision portions extending through the first release film in a second direction crossing the first direction from both ends of the first incision portion;
- and
- a second release film disposed under the printed circuit board, the second release film including an incision portion,
- wherein the first side of the fixing portion extends into the incision portion and a portion of the fixing portion is disposed under the second release film.
1 more element
Dependencies are inferred from the claim text.