H05K 2203/308
Sacrificial means
Official title: Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
H05K2203/308 (Sacrificial means) appears on 297 US grants and 357 published applications in this corpus.
Search patents in H05K- Granted patents
- 297
- Published applications
- 357
- Assignees
- 166
- Inventors
- 796
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 1 |
| 2002 | 1 | 3 |
| 2003 | 1 | 4 |
| 2004 | 5 | 6 |
| 2005 | 4 | 14 |
| 2006 | 7 | 12 |
| 2007 | 1 | 15 |
| 2008 | 8 | 24 |
| 2009 | 16 | 34 |
| 2010 | 19 | 31 |
| 2011 | 17 | 15 |
| 2012 | 21 | 13 |
| 2013 | 15 | 9 |
| 2014 | 5 | 13 |
| 2015 | 21 | 15 |
| 2016 | 13 | 18 |
| 2017 | 10 | 16 |
| 2018 | 10 | 14 |
| 2019 | 22 | 15 |
| 2020 | 15 | 19 |
| 2021 | 12 | 12 |
| 2022 | 9 | 14 |
| 2023 | 5 | 12 |
| 2024 | 10 | 15 |
| 2025 | 13 | 10 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semi-flex printed circuit board27 Jan 2026US 12,538,430 B2Tripod (Wuxi) Electronic Co., Ltd.
- Semi-flex printed circuit board with cover-opening opening27 Jan 2026US 12,538,436 B2Tripod (Wuxi) Electronic Co., Ltd.
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,348 B2Samsung Electro-Mechanics Co., Ltd.
- Manufacturing component carrier with cavity by trimming poorly adhesive structure before removing stack material23 Dec 2025US 12,507,350 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Silicon flexible connectors9 Dec 2025US 12,494,599 B2Northrop Grumman Systems Corporation
- Manufacturing Component Carrier With Cavity by Trimming Poorly Adhesive Structure Before Removing Stack Material9 Apr 2026US 2026/0101448 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for fabricating a circuit board arrangement, circuit board pre-assembly and implantable medical device comprising a circuit board arrangement26 Mar 2026US 2026/0089901 A1Biotronik SE & Co.KG
- Circuit board and manufacturing method thereof26 Feb 2026US 2026/0059646 A1Avary Holding (Shenzhen) Co., Limited.
- Printed Circuit Board Including a First Portion and a Second Portion with a Pillar Extending from the First Portion6 Nov 2025US 2025/0344318 A1Google Inc.
- Component Carrier With Cavity and Laser Protection Structure28 Aug 2025US 2025/0273593 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Method of making multilayer circuit103US 5,590,460 ATessera, Inc. · 1997
- Stacked module and manufacturing method thereof84US 7,807,499 B2Murata Manufacturing Co., Ltd. · 2010
- Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same65US 5,262,594 ACompaq Computer Corporation · 1993
- Integrated electronic components and methods of formation thereof53US 7,755,174 B2Nuvotonics, LLC · 2010