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US 7,807,499 B2Granted
Stacked module and manufacturing method thereof
AssigneeMurata Manufacturing Co., Ltd.
InventorYoshihiko Nishizawa
Life of this patent
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Abstract
A manufacturing method of a stacked module includes a step of fabricating the first wiring board which includes a wiring pattern provided on at least one of a surface and an inner portion and a bump electrode which is integrated from the simultaneous sintering with the wiring pattern, and which extends in the vertical direction, a step of layering the first wiring board with the second wiring board having the wiring pattern provided on at least one of the surface and the inner portion thereof to be connected to the second wiring board via the bump electrode.
Claims14
A stacked module manufacturing method comprising:
- a step of creating a first wiring board having a bump which is integrated with a board and extends in a direction substantially perpendicular to a surface of the board;
- a step of layering a second wiring board, which has a wiring pattern provided on at least one of a surface and an inner side thereof, on said first wiring board;
- and
- a step of connecting said second wiring board to said first wiring board via said bump;
- wherein
- said bump is disposed on the surface of the board and extends only in a direction away from the surface of the board on which the bump is disposed;
- said first wiring board further comprises a wiring pattern provided on at least one of the surface and an inner side thereof;
- and
- said bump is a bump electrode integrated with said wiring pattern by simultaneous sintering.
6 more elements
Dependencies are inferred from the claim text.