H05K 2203/306
Lifting the component during or after mounting
Official title: Lifting the component during or after mounting; Increasing the gap between component and PCB
H05K2203/306 (Lifting the component during or after mounting) appears on 51 US grants and 42 published applications in this corpus.
Search patents in H05K- Granted patents
- 51
- Published applications
- 42
- Assignees
- 37
- Inventors
- 112
- Latest grant
- 14 Nov 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 6 |
| 2003 | 4 | 4 |
| 2004 | 2 | 5 |
| 2005 | 2 | 2 |
| 2006 | 3 | 7 |
| 2007 | 2 | 2 |
| 2008 | 3 | 5 |
| 2009 | 3 | 4 |
| 2010 | 0 | 1 |
| 2011 | 3 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 1 | 0 |
| 2016 | 1 | 2 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor module and electronic apparatus14 Nov 2023US 11,818,844 B2Canon Kabushiki Kaisha
- Increasing solder hole-fill in a printed circuit board assembly29 May 2018US 9,986,649 B2International Business Machine Corporation
- Increasing solder hole-fill in a printed circuit board assembly30 May 2017US 9,662,732 B2International Business Machines Corporation
- Increasing solder hole-fill in a printed circuit board assembly30 Aug 2016US 9,427,828 B2International Business Machines Corporation
- Grounding gasket and electronic apparatus7 Jul 2015US 9,078,351 B2Kabushiki Kaisha Toshiba
- Semiconductor module and electronic apparatus1 Dec 2022US 2022/0386468 A1Canon Kabushiki Kaisha
- Increasing solder hole-fill in a printed circuit board assembly18 May 2017US 2017/0142845 A1International Business Machines Corporation
- Increasing solder hole-fill in a printed circuit board assembly13 Oct 2016US 2016/0297022 A1International Business Machines Corporation
- Increasing solder hole-fill in a printed circuit board assembly11 Feb 2016US 2016/0044791 A1International Business Machines Corporation
- Grounding gasket and electronic apparatus15 May 2014US 2014/0133116 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Surface mount type package unit and method for manufacturing the same91US 5,901,046 ADenso Corporation · 1999
- Electronic circuit device89US 5,684,677 AKabushiki Kaisha Toshiba · 1997
- Method of mounting an electronic part with bumps on a circuit board88US 5,489,750 AMatsushita Electric Industrial Co., Ltd. · 1996
- Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal79US 6,633,078 B2Mitsubishi Denki Kabushiki Kaisha · 2003
- Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array62US 5,639,696 ALSI Logic Corporation · 1997