H05K 2203/176
Removing, replacing or disconnecting component
Official title: Removing, replacing or disconnecting component; Easily removable component
H05K2203/176 (Removing, replacing or disconnecting component) appears on 246 US grants and 225 published applications in this corpus.
Search patents in H05K- Granted patents
- 246
- Published applications
- 225
- Assignees
- 166
- Inventors
- 775
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 8 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 11 | 0 |
| 2001 | 9 | 2 |
| 2002 | 8 | 7 |
| 2003 | 11 | 6 |
| 2004 | 6 | 9 |
| 2005 | 4 | 6 |
| 2006 | 5 | 10 |
| 2007 | 3 | 12 |
| 2008 | 1 | 6 |
| 2009 | 6 | 16 |
| 2010 | 7 | 8 |
| 2011 | 9 | 5 |
| 2012 | 2 | 9 |
| 2013 | 3 | 12 |
| 2014 | 9 | 12 |
| 2015 | 11 | 10 |
| 2016 | 8 | 12 |
| 2017 | 8 | 9 |
| 2018 | 9 | 13 |
| 2019 | 11 | 5 |
| 2020 | 3 | 11 |
| 2021 | 11 | 5 |
| 2022 | 7 | 10 |
| 2023 | 6 | 6 |
| 2024 | 4 | 12 |
| 2025 | 3 | 6 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Rework patch for an electronic circuit10 Mar 2026US 12,575,034 B2Jabil Inc.
- Molded packages with through-mold interconnects17 Feb 2026US 12,557,221 B2NXP USA, Inc.
- Method of recycling integrated circuits3 Feb 2026US 12,541,746 B2Phinia Jersey Holdings LLC
- Device and method for replacing at least one chip27 Jan 2026US 12,538,609 B2OSRAM Opto Semiconductors GmbH
- Electronic device23 Jul 2026US 2026/0214796 A1AUO Corporation
- Hot air liquid conductive cooling (halcc) device16 Jul 2026US 2026/0206146 A1Flex Ltd.
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
- Method and system of manufacturing printed wiring board26 Mar 2026US 2026/0089846 A1Sumitomo Electric Printed Circuits, Inc.
- Printed circuit board and method of manufacturing the same26 Mar 2026US 2026/0089849 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Spring biased tapered contact elements for electrical connectors and integrated circuit packages103US 5,366,380 AGeneral DataComm, Inc. · 1994
- Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement81US 5,516,030 ACompaq Computer Corporation · 1996
- Lead-free interconnection for electronic devices70US 5,854,514 AInternational Buisness Machines Corporation · 1998
- Integral heater for reworking MCMS and other semiconductor components68US 6,031,729 ATRW Inc. · 2000
- Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement61US 5,769,989 AInternational Business Machines Corporation · 1998