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AssigneeInternational Business Machines Corporation
InventorsMark Kenneth Hoffmeyer, David A. Sluzewski
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A configuration of surface-mounted circuit assembly has four layers, namely, an integrated circuit device, an adhesive layer, a solder layer and the carrier board. The integrated circuit device is attached to the solder layer which sets on top of the carrier board, with the adhesive layer between the integrated circuit device and the solder layer. The carrier board has at least one via located beneath where the integrated circuit is located. The via is filled with solder such that the solder layer at which the integrated circuit device is situated is thermo-conductively connected to the back side of the carrier board. This configuration allows the integrated circuit device to be easily removed from the carrier board by the application of heat to the back side of the carrier board.
A surface-mounted circuit assembly comprising:
A method for removably mounting an integrated circuit device to a surface-mounted circuit assembly, wherein said surface mounted circuit assembly includes a carrier board having an upper surface and a lower surface, wherein said carrier board has at least one via therethrough and at least one mounting site on said upper surface of said carrier board, said method comprising the steps of:
Dependencies are inferred from the claim text.