US 12,538,609 B2Granted

Device and method for replacing at least one chip

AssigneeOSRAM Opto Semiconductors GmbH

InventorTobias Meyer

Life of this patent

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Abstract

A device for replacing at least one chip or electronic element of an electronic component, in particular an LED package or an LED display, includes at least two standard electrical contacts to which a chip comprising at least two electrical contacts is electrically connectable. The device also includes an electronic switch electrically connecting the first standard electrical contact to an electrical power supply source, and least three electrical repair contacts to which a repair chip identical in construction to the chip is electrically connectable. The first electrical repair contact is electrically connected to the electrical power supply source. The second electrical repair contact is electrically connected to the electronic switch. The third electrical repair contact is electrically connected to the second electrical standard contact.

Claims22

Dependent claims

A device for replacing at least one chip or electronic element of an electronic component, comprising

at least a first and a second standard electrical contact to which a chip comprising at least a first and a second electrical contact is electrically connectable;
an electronic switch electrically connecting the first standard electrical contact to an electrical power supply source;
and
at least a first, a second and a third electrical repair contact to which a repair chip identical in construction to the chip is electrically connectable, the first electrical repair contact being electrically connected to the electrical power supply source, the second electrical repair contact being electrically connected to the electronic switch, and the third electrical repair contact being electrically connected to the second standard electrical contact, wherein the first electrical repair contact is electrically isolated from the second electrical repair contact when the first electrical repair contact and the second electrical repair contact are free from being electrically connected to the repair chip.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 17/434,495Filed 13 Feb 2020
Priority: DE 10 2019 105 031.627 Feb 2019
Published: US 2022/0140180 A15 May 2022
Granted: 27 Jan 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10H 20/01
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: manufacture or treatment
H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H05K 1/0295
Programmable, customizable or modifiable circuits: adapted for choosing between different types or different locations of mounted components
H10W 90/00
Package configurations