H05K 2203/1322
Encapsulation comprising more than one layer
H05K2203/1322 (Encapsulation comprising more than one layer) appears on 163 US grants and 184 published applications in this corpus.
Search patents in H05K- Granted patents
- 163
- Published applications
- 184
- Assignees
- 134
- Inventors
- 430
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 4 |
| 2008 | 1 | 9 |
| 2009 | 0 | 6 |
| 2010 | 5 | 10 |
| 2011 | 6 | 7 |
| 2012 | 7 | 3 |
| 2013 | 4 | 6 |
| 2014 | 3 | 3 |
| 2015 | 4 | 10 |
| 2016 | 6 | 9 |
| 2017 | 13 | 17 |
| 2018 | 13 | 12 |
| 2019 | 15 | 9 |
| 2020 | 8 | 15 |
| 2021 | 10 | 10 |
| 2022 | 10 | 16 |
| 2023 | 11 | 16 |
| 2024 | 11 | 10 |
| 2025 | 13 | 6 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conformal electromagnetic interference shielding film18 Aug 2026US 12,713,572 B2Microsoft Technology Licensing, LLC
- Electronic assemblies including a conformal moisture barrier26 May 2026US 12,635,857 B2Intuitive Surgical Operations, Inc.
- Conductive module12 May 2026US 12,628,279 B2Yazaki Corporation
- Barrier layer for an electrical device14 Apr 2026US 12,604,419 B2Honeywell International Inc.
- Electronic package and method for making the same31 Mar 2026US 12,593,397 B2
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Electronic package and method for making the same9 Jul 2026US 2026/0197934 A1JCET STATS ChipPAC Korea Limited
- Resin laminate formation device and resin laminate formation method18 Jun 2026US 2026/0166873 A1Fuji Corporation
- Optoelectronic device30 Apr 2026US 2026/0123122 A1ams-OSRAM International GmbH
Most cited
By later US patents
- Process and device for hermetic encapsulation of electronic components98US 5,461,545 AThomson-CSF · 1995
- Waterproof USB drives and method of making89US 7,652,892 B2Kingston Technology Corporation · 2010
- Encapsulated electronic component having a heat diffusing layer73US 5,379,186 AMotorola, Inc. · 1995
- Printed circuit packaging for high vibration and temperature environments46US 4,768,286 AEastman Christensen Company · 1988
- Encapsulated product and method of manufacture39US 5,319,522 AFord Motor Company · 1994