Encapsulated product and method of manufacture
AssigneeFord Motor Company
InventorRajendra M. Mehta
Life of this patent
Estimating the term…
Abstract
A method is provided for encapsulating an object with a heat-shrinkable material prior to subjecting the encapsulated object to insert, injection molding. The encapsulation protects the object from thermal damage by preventing contact with the injected polymer. In addition, the encapsulation protects the object from contact by any liquids or other foreign materials which penetrate the molded enclosure.
Claims20
An encapsulated product, comprising:
- an object enclosed within a molded plastic material;
- and
- an encapsulating shell positioned around said object and interposed between said object and said molded plastic material such that said molded plastic material is prevented from contacting said object, said encapsulating shell comprising a heat-shrinkable material which has been heat shrunk to encapsulate said object.
A method of making an encapsulated product, comprising the steps of:
- forming an encapsulating shell around an object, said encapsulating shell conforming to the outer contour of said object such that no void spaces exist between said object and said encapsulating shell;
- placing the encapsulated object in a mold having a cavity with a predetermined shape;
- adding a flowable polymer to said mold such that said encapsulated object is completely surrounded by said flowable polymer, said encapsulating shell minimizing contact with said object by said flowable polymer;
- and
- solidifying said flowable polymer.
A method of encasing an electrical or electronic device in a molded housing, said electrical or electronic device having a plurality of electrical contact leads attached thereto, said method comprising the steps of:
- positioning a heat-shrinkable material around said electrical or electronic device;
- applying sufficient heat to said heat-shrinkable material to activate said heat-shrinkable material such that said heat-shrinkable material forms an encapsulating shell around said electrical or electronic device, said encapsulating shell conforming to the outer contour of said electrical or electronic device such that no void spaces exist between said electrical or electronic device and said encapsulating shell, said heat-shrinkable material being positioned to form at least one opening in said encapsulating shell through which said electrical contact leads extend, said opening being adapted to minimize contact with said electrical device by materials which enter said opening;
- placing said encapsulated electrical or electronic device in a mold having a cavity with a predetermined shape;
- adding flowable polymer to said mold such that said encapsulated electrical or electronic device is substantially completely surrounded by said flowable polymer, said heat-shrinkable material substantially minimizing contact with said electrical or electronic device by said flowable polymer;
- and
- solidifying said flowable polymer.
Dependencies are inferred from the claim text.