Resin laminate formation device and resin laminate formation method

Abstract

A resin laminate formation device including an ejection device configured to eject a curable resin into a film shape to cover an upper surface of a component mounted in a cavity formed in a base and to cover an upper surface of the base, the component having a height dimension longer than a depth dimension of the cavity; and a planarization device configured to planarize the curable resin ejected from the ejection device at a set height which is set at a position higher than the upper surface of the component in a state of being mounted in the cavity, in which ejection of the curable resin from the ejection device and planarizing by the planarization device are repeatedly performed, whereby a resin laminate having an upper surface height with the set height is formed on the base by laminating the film-shaped curable resin.

Dependencies are inferred from the claim text.