US 4,768,286 A · Printed circuit packaging for high vibration and temperature environments

Abstract

A method for manufacturing a reusable package for printed circuits boards in oil tools which is protected from high vibration and high temperature environments is comprised of the steps of vacuum forming a thin layer of mold release film over the printed circuit board. The printed circuit board together with its intimately formed mold release film is then potted in a conventional manner within a protective package filled with a resilient curable foam. The foam is poured in an uncured state around the components of the printed circuit board and cured in place. After the potting material is cured the printed circuit board is removed from the resilient potting material and the mold release layer is stripped from the printed circuit board. Thereafter the printed circuit board is reassembled in the conformally molded resilient potting and additional foam may be added to the printed circuit board and the electronic packaging to gently urge the printed circuit board into intimate conformal contact with the conformally mated potting. The electronic package is then completed or enclosed in a conventional manner with the printed circuit board snugly retained within the conformally molded potting.

Claims4

Dependent claims

A method for packaging an electronic circuit comprising the steps of:

disposing a mold release agent on said circuit;
disposing a resilient potting material, said resilient potting material in said mold release agent being intimately conformed to said physical surfaces of said circuit;
and
disposing said potted circuit in a circuit package,
whereby said circuit is protected from external temperatures and insulated from high vibration while being removable from said potting material for alteration or repair and reinsertable in said potting material without loss of temperature protection or vibration insolation,
further comprising the step of:
removing said circuit from said potting material;
removing said mold release agent from said circuit;
and
disposing said circuit into said potting material, said potting material maintaining intimate conformal physical contact with said circuit,
further comprising the step of:
disposing means within said circuit package for urging said circuit into intimate physical contact with said conformally molded potting material,
where in said step of disposing said means for urging said printed circuit board into intimate contact with said physical surfaces of said circuit, a resilient foam layer is disposed within said packaging to gently and uniformly press said circuit into said conformally molded and mating cured solid potting material.

10 more elements

A method for protecting a circuit against high vibration loads while permitting easy access thereto to repair, comprising the steps of:

vacuum forming a thin plastic layer over each surface of said circuit provided with components extending from said printed circuit board;
pouring uncured liquid potting material into a package for said printed circuit board;
completely immersing each surface of said printed circuit board having components extending therefrom into said uncured liquid potting material contained within said package;
curing said liquid potting material to transform said potting material into a resilient solid;
removing said printed circuit board from said cured resilient solid potting material;
removing said vacuum formed plastic from said printed circuit board and components thereon;
redisposing said printed circuit board with said plastic film removed into said resilient solid potting material in such a manner that said circuit board intimately and conformally mates with corresponding surfaces defined within said potting material during said step of immersing and curing;
and
completing said packaging for said printed circuit board,
whereby said printed circuit board and components thereon is provided with a removable conformally mating resilient potting covering within a packaging to protect it from high vibration and shock,
further comprising the step of disposing a separate foam layer between said printed circuit board and said packaaging to urge said printed board and components thereon into intimate and secure physical contact with said resilient potting material.

8 more elements

Dependencies are inferred from the claim text.

Printed circuit packaging for high vibration and temperature environments

Life of this patent

Printed circuit packaging for high vibration and temperature environments

Life of this patent

Abstract

Claims4