Electronic package and method for making the same

A method for making an electronic package, comprising:

• providing a substrate comprising a first region and a second region adjacent to the first region in a lengthwise direction of the substrate;
• mounting a first electronic component on the substrate in the first region;
• mounting a second electronic component on the substrate in the second region, wherein the second electronic component does not occupy an entirety of the substrate in a widthwise direction of the substrate;
• and
• forming an encapsulant layer on the substrate that extends from the first region to the second region to reinforce the substrate in both the first region and the second region, wherein at least the second electronic component is exposed from the encapsulant layer;
• wherein the encapsulant layer comprises:
• a main body in the first region and at least surrounding the first electronic component, and
• two reinforcement walls in the second region, wherein the two reinforcement walls are integrally formed with the main body, wherein the two reinforcement walls extend over an entire length of the second region.