H05K 2203/125
Inorganic compounds
Official title: Inorganic compounds, e.g. silver salt
H05K2203/125 (Inorganic compounds) appears on 109 US grants and 115 published applications in this corpus.
Search patents in H05K- Granted patents
- 109
- Published applications
- 115
- Assignees
- 98
- Inventors
- 359
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 5 |
| 2004 | 1 | 4 |
| 2005 | 1 | 3 |
| 2006 | 2 | 2 |
| 2007 | 0 | 4 |
| 2008 | 1 | 1 |
| 2009 | 1 | 11 |
| 2010 | 0 | 13 |
| 2011 | 1 | 5 |
| 2012 | 2 | 5 |
| 2013 | 3 | 8 |
| 2014 | 6 | 8 |
| 2015 | 8 | 5 |
| 2016 | 3 | 9 |
| 2017 | 8 | 6 |
| 2018 | 7 | 7 |
| 2019 | 3 | 6 |
| 2020 | 3 | 4 |
| 2021 | 6 | 3 |
| 2022 | 5 | 2 |
| 2023 | 0 | 0 |
| 2024 | 2 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks2 Sep 2025US 12,407,349 B2EKC Technology, Inc.
- Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil25 Feb 2025US 12,233,621 B2Panasonic Intellectual Property Management Co., Ltd.
- Dielectric-to-metal adhesion promotion material3 Dec 2024US 12,159,825 B2Intel Corporation
- Method for manufacturing printed wiring board and resin sheet with inorganic layer15 Oct 2024US 12,120,827 B2Ajinomoto Co., Inc.
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor18 Sep 2025US 2025/0290205 A1
- Method of manufacturing a printed circuit board assembly15 Feb 2024US 2024/0057255 A1Rolls-Royce Deutschland Ltd & Co KG
- Conductive traces4 Jan 2024US 2024/0008187 A1Hewlett-Packard Development Company, L. P.
- Dielectric-to-metal adhesion promotion material15 Sep 2022US 2022/0293509 A1Intel Corporation
Most cited
By later US patents
- Method for forming electrically conductive paths58US 4,159,414 AMassachusetts Institute of Technology · 1979
- Method for fabricating an inorganic resistor58US 7,553,512 B2Cabot Corporation · 2009
- Circuit board to be precoated with solder layers and solder circuit board53US 5,453,582 AFurukawa Electric Co., Ltd. · 1995
- Method for deposition of elemental metals and metalloids on substrates46US 4,526,807 AGeneral Electric Company · 1985
- Microetching composition for copper or copper alloy44US 5,965,036 AMec Company Ltd. · 1999