Method for deposition of elemental metals and metalloids on substrates
AssigneeGeneral Electric Company
InventorAbraham Auerbach
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Abstract
Metals and metalloids may be deposited in the form of conducting lines, spots and the like by preparing a solution or dispersion of a reducible metal or metalloid compound in an oxidizable organic matrix such as a polyamic acid or polyimide, coating the substrate with said solution or dispersion, and contacting the coated substrate with a beam of localized radiation absorbable by said coated substrate, typically a laser beam.
Claims7
A method of depositing conductive elemental metal or metalloid lines or spots on a non-conductive substrate which comprises the steps of preparing a solution or dispersion of at least one reducible metal or metalloid compound in an oxidizable organic matrix comprising a polyamic acid or polyimide prepared by the reaction of at least one aromatic diamine with 2,2-bis propane dianhydride, coating said substrate with said solution or dispersion, and contacting said coated substrate with a beam of localized radiation absorbable by said coated substrate, thereby causing reduction of said metal or metalloid to the elemental state by said matrix.
A method of depositing elemental copper or silver lines on a resinous substrate which comprises the steps of preparing a solution of at least one reducible copper or silver compound in an oxidizable organic matrix comprising a polyamic acid or polyimide prepared by the reaction of at least one aromatic diamine with 2,2-bis propane dianhydride, coating said substrate with said solution, and containing said coated substrate with a laser beam produced by a diode laser, the energy imparted by said beam being absorbable by said coated substrate, thereby causing reduction of said copper or silver to the elemental state by said matrix.
Dependencies are inferred from the claim text.