H05K 2203/12
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered
Official title: Using specific substances
H05K2203/12 (Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered) appears on 963 US grants and 883 published applications in this corpus.
Search patents in H05K- Granted patents
- 963
- Published applications
- 883
- Assignees
- 532
- Inventors
- 2,518
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 9 | 0 |
| 1986 | 13 | 0 |
| 1987 | 17 | 0 |
| 1988 | 16 | 0 |
| 1989 | 14 | 0 |
| 1990 | 22 | 0 |
| 1991 | 18 | 0 |
| 1992 | 25 | 0 |
| 1993 | 24 | 0 |
| 1994 | 18 | 0 |
| 1995 | 30 | 0 |
| 1996 | 25 | 0 |
| 1997 | 18 | 0 |
| 1998 | 25 | 0 |
| 1999 | 20 | 0 |
| 2000 | 16 | 0 |
| 2001 | 26 | 12 |
| 2002 | 29 | 38 |
| 2003 | 32 | 32 |
| 2004 | 28 | 47 |
| 2005 | 16 | 50 |
| 2006 | 21 | 53 |
| 2007 | 25 | 46 |
| 2008 | 21 | 52 |
| 2009 | 25 | 71 |
| 2010 | 30 | 72 |
| 2011 | 36 | 32 |
| 2012 | 41 | 39 |
| 2013 | 31 | 33 |
| 2014 | 28 | 35 |
| 2015 | 33 | 38 |
| 2016 | 21 | 34 |
| 2017 | 33 | 25 |
| 2018 | 23 | 27 |
| 2019 | 22 | 34 |
| 2020 | 21 | 16 |
| 2021 | 23 | 25 |
| 2022 | 19 | 20 |
| 2023 | 7 | 12 |
| 2024 | 11 | 12 |
| 2025 | 14 | 17 |
| 2026 | 5 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printed wiring board18 Aug 2026US 12,713,525 B2Ibiden Co., Ltd.
- Fully printed sensor with internal ion reservoirs18 Aug 2026US 12,713,530 B2The Regents of the University of Colorado
- Wiring substrate12 May 2026US 12,628,283 B2Ibiden Co., Ltd.
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB20 Jan 2026US 12,532,412 B2Intel Corporation
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Aluminum/ceramic bonding substrate and method for producing same30 Apr 2026US 2026/0116829 A1Dowa Metaltech Co., Ltd.
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- Ceramic circuit board and method for manufacturing same19 Mar 2026US 2026/0082479 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Heat-resistant broad-bandwidth liquid droplet generators113US 5,560,543 ABoard of Regents, The University of Texas System · 1996
- Apparatus and method for forming mold for metallic material108US 5,718,361 AInternational Business Machines Corporation · 1998