H05K 2203/128
Molten metals
Official title: Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
H05K2203/128 (Molten metals) appears on 178 US grants and 135 published applications in this corpus.
Search patents in H05K- Granted patents
- 178
- Published applications
- 135
- Assignees
- 124
- Inventors
- 404
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 1 |
| 2002 | 9 | 5 |
| 2003 | 2 | 3 |
| 2004 | 1 | 4 |
| 2005 | 2 | 6 |
| 2006 | 4 | 10 |
| 2007 | 6 | 6 |
| 2008 | 6 | 2 |
| 2009 | 5 | 9 |
| 2010 | 2 | 6 |
| 2011 | 6 | 5 |
| 2012 | 8 | 1 |
| 2013 | 5 | 2 |
| 2014 | 2 | 6 |
| 2015 | 1 | 3 |
| 2016 | 2 | 2 |
| 2017 | 4 | 4 |
| 2018 | 2 | 8 |
| 2019 | 6 | 9 |
| 2020 | 7 | 3 |
| 2021 | 7 | 10 |
| 2022 | 7 | 6 |
| 2023 | 5 | 5 |
| 2024 | 2 | 3 |
| 2025 | 6 | 9 |
| 2026 | 0 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board with embedded resistors and method for fabricating the same7 Oct 2025US 12,439,520 B2Avary Holding (Shenzhen) Co., Limited.
- Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal7 Oct 2025US 12,439,525 B2Additive Technologies LLC
- High aspect ratio vias filled with liquid metal fill17 Jun 2025US 12,336,112 B2Samtec, Inc.
- Liquid metal fusion with conductive inks and pastes17 Jun 2025US 12,336,115 B2Carnegie Mellon University
- Direct printing and writing using undercooled metallic core-shell particles18 Feb 2025US 12,226,831 B2Indium Corporation of America
- Aluminum/ceramic bonding substrate and method for producing same30 Apr 2026US 2026/0116829 A1Dowa Metaltech Co., Ltd.
- Manufacturing method for a circuit board and circuit board2 Apr 2026US 2026/0096019 A1JCET Management Co., Ltd.
- Ceramic circuit board and method for manufacturing same19 Mar 2026US 2026/0082479 A1Niterra Materials Co., Ltd.
- Method for patterning a self-healing elastomer film, patterned, laser sintered and/or electrical conductivity-improved self-healing film, a multilayer film, an electrical device and use of a programmable laser processing system for patterning a self-healing elastomer film5 Mar 2026US 2026/0061519 A1University of Oulu
- Conductive and corrosive-resistant liquid metal compositions and electronic devices using same5 Feb 2026US 2026/0040438 A1Meta Platforms Technologies, LLC
Most cited
By later US patents
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Heat-resistant broad-bandwidth liquid droplet generators113US 5,560,543 ABoard of Regents, The University of Texas System · 1996
- Apparatus and method for forming mold for metallic material108US 5,718,361 AInternational Business Machines Corporation · 1998
- Process for forming solid conductive vias in substrates92US 5,454,928 AWatkins-Johnson Company · 1995
- Solder anchor decal and method90US 5,673,846 AInternational Business Machines Corporation · 1997