Conductive and corrosive-resistant liquid metal compositions and electronic devices using same
AssigneeMeta Platforms Technologies, LLC
InventorsOmar Awartani, Marcos Antonio Santana Andrade, JR., Darpan Shukla, Behnam Sadri, Wenyang Pan, Benjamin Cook, Thomas John Farrell Wallin
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Abstract
A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.
Claims24
A method comprising:
- forming a first circuit component at a first portion of a deformable substrate;
- forming a second circuit component at a second portion of the deformable substrate;
- and
- electronically coupling the first circuit component and the second circuit component using traces including a formulation,
- wherein the formulation includes a liquid Ga-based alloy and a metal filler.
An electronic device comprising:
- a first circuit component formed at a first portion of a deformable substrate;
- a second circuit component formed at a second portion of the deformable substrate;
- and
- a plurality of traces configured to electronically couple the first circuit component to the second circuit component,
- wherein the plurality of traces comprise a formulation including a liquid Ga-based alloy and a metal filler.
A method comprising:
- forming a composition by:
- providing a liquid solution including a Ga-based alloy including nanowires;
- and
- mixing nanoparticles of a barrier material and a micro-powder with the liquid solution.
A method comprising:
- forming a first circuit component at a first portion of a deformable substrate;
- forming a second circuit component at a second portion of the deformable substrate;
- and
- tracing out at least one of a line or a via to couple the first circuit component and the second circuit component, with a composition comprising a solution with a polymer binder dissolved in at least one solvent and a liquid metal,
- wherein subsequent to the tracing out, the polymer binder polymerizes thereby forming the line or the via that couples, and electronically connects, the first circuit component and the second circuit component.
Dependencies are inferred from the claim text.