Ceramic circuit board and method for manufacturing same
AssigneeNiterra Materials Co., Ltd.
InventorsTatsuya ODA, Hiromasa KATO, Hideki SATO
Life of this patent
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Abstract
A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.
Claims15
A ceramic circuit board, comprising:
- a ceramic substrate;
- and
- a metal circuit bonded to a first surface of the ceramic substrate via an active metal brazing material layer,
- a thickness of the metal circuit being not less than 1 mm, the metal circuit having a through-hole extending through the metal circuit along a first direction perpendicular to the first surface,
- a portion of the first surface overlapping the through-hole in the first direction,
- the active metal brazing material layer being present at the portion of the first surface,
- the through-hole including
- a first end portion positioned at an upper surface of the metal circuit, and
- a second end portion facing the active metal brazing material layer,
- a ratio (D2/D1) of a dimension (D2) of the second end portion in a second direction to a dimension (D1) of the first end portion in the second direction being greater than 1.00 and not more than 1.10, the second direction being parallel to the first surface.
A ceramic circuit board, comprising:
- a ceramic substrate;
- and
- a metal circuit bonded to a first surface of the ceramic substrate via an active metal brazing material layer,
- a thickness of the metal circuit being not less than 1 mm, the metal circuit having a through-hole extending through the metal circuit along a first direction perpendicular to the first surface,
- a portion of the first surface overlapping the through-hole in the first direction,
- the active metal brazing material layer being present at the portion of the first surface,
- a solidus temperature of the active metal brazing material layer is not more than 830° C.
A method for manufacturing a ceramic circuit board, the method comprising:
- arranging an active metal brazing material on at least a first surface of a ceramic substrate;
- arranging a metal circuit on the first surface with the active metal brazing material interposed, the metal circuit having a through-hole;
- and
- bonding the metal circuit to the ceramic substrate by the active metal brazing material,
- wherein a metal pin is inserted into the through-hole and bonded to the ceramic substrate by the active metal brazing material.
Dependencies are inferred from the claim text.