H05K 2203/121
Metallo-organic compounds
H05K2203/121 (Metallo-organic compounds) appears on 203 US grants and 231 published applications in this corpus.
Search patents in H05K- Granted patents
- 203
- Published applications
- 231
- Assignees
- 155
- Inventors
- 704
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 7 | 4 |
| 2002 | 9 | 12 |
| 2003 | 9 | 13 |
| 2004 | 10 | 19 |
| 2005 | 6 | 16 |
| 2006 | 7 | 15 |
| 2007 | 6 | 16 |
| 2008 | 4 | 18 |
| 2009 | 10 | 21 |
| 2010 | 7 | 19 |
| 2011 | 8 | 9 |
| 2012 | 14 | 9 |
| 2013 | 6 | 8 |
| 2014 | 10 | 8 |
| 2015 | 4 | 9 |
| 2016 | 3 | 4 |
| 2017 | 5 | 5 |
| 2018 | 3 | 4 |
| 2019 | 6 | 6 |
| 2020 | 2 | 3 |
| 2021 | 4 | 4 |
| 2022 | 1 | 4 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 3 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB20 Jan 2026US 12,532,412 B2Intel Corporation
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Fluid connection and fluid heating device6 May 2025US 12,292,147 B2Hutchinson
- Graphene complexes and compositions thereof21 Jan 2025US 12,202,730 B2Archer Materials Limited
- Dielectric-to-metal adhesion promotion material3 Dec 2024US 12,159,825 B2Intel Corporation
- Surface-treated copper foil for high-frequency circuit and method for producing the same22 May 2025US 2025/0168969 A1Circuit Foil Luxembourg
- Coated electrical assembly20 Mar 2025US 2025/0098077 A1
- Printed product, preparation method therefor, and use thereof24 Oct 2024US 2024/0357742 A1Heraeus Electronics GmbH & Co. KG
- Metal organic frameworks (mofs) filler for enabling low cte and low dielectric constant pcb28 Sep 2023US 2023/0309220 A1Intel Corporation
- Fluid connection and fluid heating device23 Feb 2023US 2023/0053652 A1Hutchinson
Most cited
By later US patents
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987
- Method of forming etch mask using particle beam deposition70US 5,382,315 AMicroelectronics and Computer Technology Corporation · 1995
- Electrically conductive adhesive compositions60US 5,362,421 AMinnesota Mining and Manufacturing Company · 1994
- Method for fabricating an inorganic resistor58US 7,553,512 B2Cabot Corporation · 2009
- Radiation patternable functional materials, methods of their use, and structures formed therefrom57US 7,294,449 B1Kovio, Inc. · 2007