Electrically conductive adhesive compositions
AssigneeMinnesota Mining and Manufacturing Company
InventorsMichael A. Kropp, Wayne S. Mahoney
Life of this patent
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Abstract
An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120.degree.-125.degree. C.
Claims11
An anisotropically conductive adhesive curable composition comprising:
- (a) at least one cationically curable epoxy resin;
- (b) at least one thermoplastic resin essentially free of nucleophilic or metal complexing functional groups;
- (c) a multi-component thermal initiator comprising:
- (1) at least one salt of an organometallic complex cation wherein the organometallic cation is selected from a class of substituted and unsubstituted aromatic compounds based on a benzene or cyclopentadienyl nucleus, and the anion is tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hydroxypentafluoroantimonate, trifluoromethanesulfonate, or hexafluoroantimonate;
- and
- (2) at least one stabilizing additive;
- (3) at least one cure rate enhancer;
- (d) a plurality of conductive particles;
- and
- (e) optionally, at least one silane coupling agent;
- wherein the composition are curable at a temperature of about 120.degree.-125.degree. C.
A thermally cationically cured adhesive composition prepared according to the steps of:
- (a) providing a thermally cationically curable adhesive composition comprising:
- (1) at least one epoxy functional resin;
- (2) at least one thermoplastic resin essentially free of nucleophilic or metal complexing functional groups;
- (3) a multi-component thermal initiator comprising;
- (i) at least one salt of an organometallic complex cation wherein the organometallic cation is selected from a class of substituted or unsubstituted aromatic compounds based on a benzene or cyclopentadienyl nucleus, and the anion is tetrafluoroborate, hexafluorophosphate, hexafluoroarsenate, hydroxypentafluoroantimonate, trifluoromethanesulfonate, or hexafluoroantimonate:
- and
- (ii) at least one stabilizing additive;
- (iii) at least one cure rate enhancer;
- (4) a plurality of conductive particle's;
- and
- (5) optionally, at least one silane coupling agent;
- and
- (b) adding sufficient heat at a temperature of about 120.degree.-125.degree. C. to cationically cure the composition.
Dependencies are inferred from the claim text.