Back to results
US 2023/0309220 A1Published application
Metal organic frameworks (mofs) filler for enabling low cte and low dielectric constant pcb
AssigneeIntel Corporation
InventorsYang JIAO, Kyle DAVIDSON, Srinivasa ARAVAMUDHAN, Jerry T. HARRIS
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substrate is coupled to the PCB, and a die is coupled to the package substrate.
Claims25
An electronic package, comprising:
- a printed circuit board (PCB), wherein the PCB comprises:
- a glass weave;
- a resin;
- and
- metal organic frameworks (MOFs) disposed within the resin;
- a package substrate coupled to the PCB;
- and
- a die coupled to the package substrate.
5 more elements
A printed circuit board (PCB), comprising:
- glass fibers;
- and
- a resin material, wherein the resin material comprises zirconium.
An electronic system, comprising:
- a printed circuit board (PCB), wherein the PCB has a first coefficient of thermal expansion (CTE), and wherein the PCB comprises:
- a glass weave;
- a resin around the glass weave;
- and
- metal organic frameworks (MOFs) in the resin, wherein the MOFs comprise hexanuclear Zr/Hf oxyhydroxide clusters, and wherein each cluster is connected with 12 benzene-1,4-dicarboxylate ligands;
- a package substrate coupled to the PCB, wherein the package substrate has a second CTE that is substantially equal to the first CTE;
- and
- a die coupled to the package substrate.
5 more elements
Dependencies are inferred from the claim text.