Dielectric-to-metal adhesion promotion material
AssigneeIntel Corporation
InventorsRahul Manepalli, Suddhasattwa Nad, Marcel Wall, Darko Grujicic
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Abstract
An electronic substrate may be formed having at least one metal-to-dielectric adhesion promotion material layer therein. The electronic substrate may comprise a conductive metal trace, a dielectric material layer on the conductive metal trace, and the adhesion promotion material layer between the conductive metal trace and the dielectric material layer, wherein the adhesion promotion material layer comprises an organic adhesion material and a metal constituent dispersed within the organic adhesion material, wherein a metal within the metal constituent has a standard reduction potential greater than a standard reduction potential of the conductive metal trace.
Claims20
An apparatus, comprising:
- a metal trace comprising copper;
- a dielectric material layer over the metal trace;
- and
- a material layer between and in contact with the metal trace and the dielectric material layer, wherein the material layer comprises an organic material, a plurality of first metal constituents dispersed within the organic material over the metal trace, and a plurality of second metal constituents dispersed within the organic material over the plurality of first metal constituents, wherein the first metal constituents comprise copper and the second metal constituents comprise one of silver, palladium, platinum, and gold.
An apparatus, comprising:
- a metal trace comprising a first metal;
- a dielectric material layer over the metal trace;
- and
- a material layer between and in contact with the metal trace and the dielectric material layer, wherein the material layer comprises an organic material, a plurality of first metal constituents dispersed within the organic material over the metal trace, and a plurality of second metal constituents dispersed within the organic material over the plurality of first metal constituents, wherein the first metal constituents comprise the first metal and the second metal constituents comprise a second metal having a standard reduction potential greater than a standard reduction potential of the first metal.
An apparatus, comprising:
- a first metal trace comprising copper;
- a dielectric material layer over the first metal trace;
- and
- a first material layer between and in contact with the first metal trace and the dielectric material layer, wherein the first material layer comprises an organic material, a plurality of first metal constituents dispersed within the organic material over the first metal trace, and a plurality of second metal constituents dispersed within the organic material over the plurality of first metal constituents, wherein the first metal constituents comprise copper and the second metal constituents comprise one of silver, palladium, platinum, and gold;
- a second metal trace on the dielectric material layer, the second metal trace comprising copper;
- a solder resist material layer over the second metal trace;
- a second material layer between and in contact with the second metal trace and the solder resist material layer, wherein the second material layer comprises the organic material, a plurality of the first metal constituents dispersed within the organic material over the second metal trace, and a plurality of third metal constituents dispersed within the organic material over the plurality of first metal constituents, the third metal constituents comprise another one of silver, palladium, platinum, and gold.
Dependencies are inferred from the claim text.