H05K 2203/122
Organic non-polymeric compounds
Official title: Organic non-polymeric compounds, e.g. oil, wax or thiol
H05K2203/122 (Organic non-polymeric compounds) appears on 450 US grants and 385 published applications in this corpus.
Search patents in H05K- Granted patents
- 450
- Published applications
- 385
- Assignees
- 257
- Inventors
- 1,136
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 11 | 0 |
| 1987 | 10 | 0 |
| 1988 | 12 | 0 |
| 1989 | 7 | 0 |
| 1990 | 14 | 0 |
| 1991 | 11 | 0 |
| 1992 | 10 | 0 |
| 1993 | 14 | 0 |
| 1994 | 10 | 0 |
| 1995 | 14 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 13 | 8 |
| 2002 | 10 | 12 |
| 2003 | 22 | 12 |
| 2004 | 13 | 19 |
| 2005 | 5 | 24 |
| 2006 | 7 | 26 |
| 2007 | 12 | 23 |
| 2008 | 10 | 32 |
| 2009 | 11 | 34 |
| 2010 | 22 | 34 |
| 2011 | 21 | 13 |
| 2012 | 17 | 23 |
| 2013 | 17 | 16 |
| 2014 | 13 | 15 |
| 2015 | 18 | 11 |
| 2016 | 8 | 17 |
| 2017 | 14 | 9 |
| 2018 | 8 | 8 |
| 2019 | 6 | 14 |
| 2020 | 7 | 7 |
| 2021 | 7 | 8 |
| 2022 | 6 | 8 |
| 2023 | 2 | 3 |
| 2024 | 7 | 4 |
| 2025 | 3 | 3 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printed wiring board18 Aug 2026US 12,713,525 B2Ibiden Co., Ltd.
- Fully printed sensor with internal ion reservoirs18 Aug 2026US 12,713,530 B2The Regents of the University of Colorado
- Wiring substrate12 May 2026US 12,628,283 B2Ibiden Co., Ltd.
- Composite copper components17 Jun 2025US 12,336,116 B2Namics Corporation
- Process for localized repair of graphene-coated lamination stacks and printed circuit boards29 Apr 2025US 12,289,839 B2Bar-Ilan University
- Films, methods of making films, and devices incorporating the film17 Sep 2026US 2026/0282239 A1
- Copper etchant12 Feb 2026US 2026/0043144 A1Mec Company Ltd.
- Method for nano etching of copper and copper alloy surfaces9 Oct 2025US 2025/0313958 A1Atotech Deutschland GmbH
- Triazole compound, method for synthesizing said triazole compound, coupling agent and uses thereof26 Jun 2025US 2025/0206764 A1Shikoku Chemicals Corporation
- Ink, method for manufacturing ink, and method for manufacturing multilayer ceramic capacitor20 Feb 2025US 2025/0059393 A1
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Process for manufacturing a printed wiring board107US 6,775,907 B1International Business Machines Corporation · 2004
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999
- Thermally stable dual metal coated laminate products made from textured polyimide film78US 4,868,071 APolyonics Corporation · 1989