H05K 2203/124
Heterocyclic organic compounds
Official title: Heterocyclic organic compounds, e.g. azole, furan
H05K2203/124 (Heterocyclic organic compounds) appears on 179 US grants and 176 published applications in this corpus.
Search patents in H05K- Granted patents
- 179
- Published applications
- 176
- Assignees
- 107
- Inventors
- 469
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 4 |
| 2002 | 4 | 8 |
| 2003 | 15 | 7 |
| 2004 | 7 | 14 |
| 2005 | 3 | 15 |
| 2006 | 4 | 8 |
| 2007 | 9 | 14 |
| 2008 | 6 | 14 |
| 2009 | 6 | 15 |
| 2010 | 10 | 19 |
| 2011 | 9 | 5 |
| 2012 | 9 | 11 |
| 2013 | 12 | 5 |
| 2014 | 4 | 3 |
| 2015 | 8 | 1 |
| 2016 | 2 | 6 |
| 2017 | 2 | 4 |
| 2018 | 3 | 1 |
| 2019 | 2 | 5 |
| 2020 | 2 | 2 |
| 2021 | 2 | 5 |
| 2022 | 4 | 4 |
| 2023 | 1 | 1 |
| 2024 | 5 | 3 |
| 2025 | 1 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board18 Aug 2026US 12,713,525 B2Ibiden Co., Ltd.
- Wiring substrate12 May 2026US 12,628,283 B2Ibiden Co., Ltd.
- Composite copper components17 Jun 2025US 12,336,116 B2Namics Corporation
- Dielectric-to-metal adhesion promotion material3 Dec 2024US 12,159,825 B2Intel Corporation
- Method for increasing adhesion strength between a metal and an organic material21 May 2024US 11,991,835 B2Atotech Deutschland GmbH
- Copper etchant12 Feb 2026US 2026/0043144 A1Mec Company Ltd.
- Triazole compound, method for synthesizing said triazole compound, coupling agent and uses thereof26 Jun 2025US 2025/0206764 A1Shikoku Chemicals Corporation
- Modified copper surface, heteroaromatic silane compounds and their usage for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation30 May 2024US 2024/0179851 A1Atotech Deutschland GmbH
- Printed wiring board1 Feb 2024US 2024/0040692 A1Ibiden Co., Ltd.
- Wiring substrate4 Jan 2024US 2024/0008191 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999
- Circuit board material and electroplating bath for the production thereof64US 4,892,776 AOhmega Electronics, Inc. · 1990
- Copper coating of printed circuit boards61US 5,800,859 A1998
- Composition for treating copper or copper alloy surfaces54US 5,532,094 AMec Company Ltd. · 1996
- Multilayer printed circuit board and method of producing the same48US 5,827,604 AIbiden Co., Ltd. · 1998