Printed wiring board
AssigneeIbiden Co., Ltd.
InventorsKentaro WADA, Koji KONDO, Kenji KUNIEDA, Masashi UMETSU, Yuta OKAGA
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Abstract
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less.
Claims20
A printed wiring board, comprising:
- an insulating layer;
- a conductor layer formed on the insulating layer;
- an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer;
- and
- a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer,
- wherein the conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 μm or less.
Dependencies are inferred from the claim text.