Copper coating of printed circuit boards
OwnerAndrew David Price, Peter Thomas McGrathinventors
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Abstract
A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant.
Claims32
A process for treating a metal surface to promote adhesion thereto, comprising contacting the metal surface with an adhesion promotion composition comprising 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant to form a microroughened conversion-coated surface, and adhering a material to the microroughened conversion-coated surface.
Dependencies are inferred from the claim text.