Composition for treating copper or copper alloy surfaces
AssigneeMec Company Ltd.
InventorsMaki Arimura, Daisaku Akiyama, Toshiko Nakagawa
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Abstract
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.
Claims6
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising:
- an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising:
- a cupric azole complex, an organic acid and a halogen ion.
A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising:
- 1-15% by weight of a cupric azole complex, 0.1-30% by weight of an organic acid and 0.01-20% by weight of a halogen atom.
Dependencies are inferred from the claim text.